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[FR] [F253732] 法国求购树脂(encapsulation resin) (09-09)
  Encapsulation resin bi-component Thermal conductivity > 1.5W/mk; Hardness < 60 ShoreA; CTE < 200 ppm; dielectric strengh > 10 KV/mm ; vicosity < 40000 cps.

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按国家找买家: a b c d e f g h i j k l m n o p q r s t u v w x y z
 

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