Global Buyer Inquiry |
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765940 [PH]
菲律宾求购硅片(Silicon Wafer) |
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Silicon Wafer (test wafers for beta process, p-type)
Silicon Wafer Specification
Final Process Application: Test wafers for beta process, p-type
A. Substrate SP-beta-04
Crystal growth method: Cz, test grade
Wafer size: 150 mm diameter x 125 mm square (see page 2)
Substrate Type: p-type
Dopant: Boron
Substrate Resistivity: greater than 10 W.cm
Orientation: <100> +/- 1 degree
Flat orientation, primary: {110} +/- 1 degree
Wafer Thickness: 250 550 um
Surface finish: Single side polished
Other surface finish: None
Edge rounding: Yes
Parameters:
Parameter
Min
Ave
Max
Unit
Method
Diameter
149.5
150.5
mm
Length/Width
124.5
125.5
mm
Resistivity
10
�-cm
Thickness
250
550
microns
Oxygen content
N/A
Primary flat length
Secondary flat length
N/A
Minority carrier length
na
TTV
N/A
N/A
Warp
N/A
N/A
Bow
N/A
N/A
Shipping packaging: coin rolled, 10 wafers per package, plastic bagged. Box in protective boxes weighing no more than 50 lbs. with appropriate padding for individual box shipment.
Special Requirements:
Identify with laser scribe mark on polished side within 3mm of edge
Dimensions of the 125 mm pseudosquare wafer
Distance between squared sides: 125.0 � 0.5 mm
Diameter of rounded corners: 150.0 � 0.5 mm
Tolerance between centers of square and circle: D = 0.5 mm
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Post date 4-21, value member points ?
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